This may be a dumb question but how can I find out if my G.Skill F4-3333C16Q-32GTZB is Samsung B die? I downloaded Thaiphoon Burner and did a Read of the DIMMs. The report says they are Samsung model K4A4G085WE-BCPB, DRAM Device Package Standard Monolithic, 78 Ball FBGA, Single Die. It also says Module Speed Grade is DDR4-2133P down bin. Not sure what that means. It also says Base Module Type is UDIMM which confuses me because reading about DDR4 DIMM types (UDIMM, RDIMM, LRDIMM, LRDIMM 3DS TSV, NVDIMM) indicates UDIMMs are the cheapest and lowest performing type. From the book "DDR4 for Dummies" (me):
"Unbuffered dual in‐line memory module (UDIMM) is the most
cost efficient memory. It’s usually used in cost conscious
servers (such as the HPE ML10 or DL20) and is subject to
certain limitations. It’s not ideal for highest speeds due to
high loadings on the command/address signals and you can
only populate a maximum of 2 DIMMs per channel."
The text also seems to say that DDR4 DIMMs for Haswell are different than for Broadwell though I may be mis-interpreting the text:
"Back in DDR3‐land, you had the choice among three different
types of DIMMs (UDIMMs, RDIMMs, LRDIMMs). The choices
for DDR4 were narrowed down with the launch of Xeon v3
(Haswell) to two types, RDIMMs and LRDIMMs. The main
reason UDIMMs were left out this time is that at higher DDR4
speeds you won’t get any advantage over RDIMMs anymore
when it comes to performance and reliability. With the intro-
duction of Broadwell (Xeon v4), UDIMMs are coming back as
HPE Standard Memory on HPE 10/100 Series rack and tower
server,"
I have attached the Thaiphoon read dump.
Can anyone help me out here? I am reading up on memory in general and DDR4 in particular and for starters want to know if my sticks are B- die which seems to be preferred.
Thanks !
"Unbuffered dual in‐line memory module (UDIMM) is the most
cost efficient memory. It’s usually used in cost conscious
servers (such as the HPE ML10 or DL20) and is subject to
certain limitations. It’s not ideal for highest speeds due to
high loadings on the command/address signals and you can
only populate a maximum of 2 DIMMs per channel."
The text also seems to say that DDR4 DIMMs for Haswell are different than for Broadwell though I may be mis-interpreting the text:
"Back in DDR3‐land, you had the choice among three different
types of DIMMs (UDIMMs, RDIMMs, LRDIMMs). The choices
for DDR4 were narrowed down with the launch of Xeon v3
(Haswell) to two types, RDIMMs and LRDIMMs. The main
reason UDIMMs were left out this time is that at higher DDR4
speeds you won’t get any advantage over RDIMMs anymore
when it comes to performance and reliability. With the intro-
duction of Broadwell (Xeon v4), UDIMMs are coming back as
HPE Standard Memory on HPE 10/100 Series rack and tower
server,"
I have attached the Thaiphoon read dump.
Can anyone help me out here? I am reading up on memory in general and DDR4 in particular and for starters want to know if my sticks are B- die which seems to be preferred.
Thanks !
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