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...release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms
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(25 November 2019) – G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms, including the high-capacity DDR4-3600 CL16-19-19-39 256GB (32GBx8), DDR4-4000 CL18-22-22-42 256GB (32GBx8), and the high-speed, low-latency DDR4-4000 CL15-16-16-36 64GB (8GBx8) specifications. By bringing ultra-high 32GB memory module capacity into the realm of HEDT computing, powerful workstations are now truly able to achieve a complete combination of high core count processor with high-speed, high-capacity memory for heavy workloads or for running more virtual machines than ever.
Full Power of the Intel X299 Platform
Built for the ultimate memory performance, the G.SKILL is releasing the DDR4-4000 CL15-16-16-36 64GB (8GBx8) memory specification that combines both extremely high speed and ultra-low latency in a high capacity 64GB memory kit. As seen validated on the new Intel® Core™ i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE and MSI Creator X299 motherboards in the screenshots below, this supremely fast memory kit is the ideal choice for high-performance workstations:
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For ultra-high capacity memory kits, built with the latest high-density 32GB modules, the DDR4-4000 CL18-22-22-42 256GB (32GBx8) is the perfect choice for memory hungry applications, like running multiple virtual machines. In the screenshot below, this behemoth memory kit is seen validated with Intel® Core™ i9-9920X and i9-9820X processors with the MSI Creator X299 and ASUS PRIME X299-DELUXE II motherboards, respectively.
Pushing the Limits of the AMD TRX40 Platform
Built for use with the latest 3rd Gen AMD Ryzen Threadripper processors and optimized for squeezing out every last ounce of performance, G.SKILL has integrated low latency specifications of DDR4-3600 CL14-15-15-35 into a 64GB (8GBx8) Trident Z Neo memory kit. In the following screenshot, this highly efficient memory kit is validated with the latest AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard.
G.SKILL is also launching an ultra-high capacity memory kit based on high-density 32GB memory modules for the AMD platform, with the DDR4-3600 CL16-19-19-39 256GB (32GBx8) specification. This extreme capacity memory kit is also validated with the AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard in the screenshot below.
Availability & XMP 2.0 Support
These high-performance quad-channel memory specifications will support Intel XMP 2.0 for easy overclocking and will be available via G.SKILL worldwide distribution partners in late Q4 2019. Please see the specifications table below for a more complete list of the upcoming quad-channel memory kits.
(25 November 2019) – G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, is pleased to announce the release of new high-performance and high-capacity quad-channel memory kits for the latest Intel X299 and AMD TRX40 high-end desktop (HEDT) platforms, including the high-capacity DDR4-3600 CL16-19-19-39 256GB (32GBx8), DDR4-4000 CL18-22-22-42 256GB (32GBx8), and the high-speed, low-latency DDR4-4000 CL15-16-16-36 64GB (8GBx8) specifications. By bringing ultra-high 32GB memory module capacity into the realm of HEDT computing, powerful workstations are now truly able to achieve a complete combination of high core count processor with high-speed, high-capacity memory for heavy workloads or for running more virtual machines than ever.
Full Power of the Intel X299 Platform
Built for the ultimate memory performance, the G.SKILL is releasing the DDR4-4000 CL15-16-16-36 64GB (8GBx8) memory specification that combines both extremely high speed and ultra-low latency in a high capacity 64GB memory kit. As seen validated on the new Intel® Core™ i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE and MSI Creator X299 motherboards in the screenshots below, this supremely fast memory kit is the ideal choice for high-performance workstations:
For ultra-high capacity memory kits, built with the latest high-density 32GB modules, the DDR4-4000 CL18-22-22-42 256GB (32GBx8) is the perfect choice for memory hungry applications, like running multiple virtual machines. In the screenshot below, this behemoth memory kit is seen validated with Intel® Core™ i9-9920X and i9-9820X processors with the MSI Creator X299 and ASUS PRIME X299-DELUXE II motherboards, respectively.
Pushing the Limits of the AMD TRX40 Platform
Built for use with the latest 3rd Gen AMD Ryzen Threadripper processors and optimized for squeezing out every last ounce of performance, G.SKILL has integrated low latency specifications of DDR4-3600 CL14-15-15-35 into a 64GB (8GBx8) Trident Z Neo memory kit. In the following screenshot, this highly efficient memory kit is validated with the latest AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard.
G.SKILL is also launching an ultra-high capacity memory kit based on high-density 32GB memory modules for the AMD platform, with the DDR4-3600 CL16-19-19-39 256GB (32GBx8) specification. This extreme capacity memory kit is also validated with the AMD Ryzen Threadripper 3960X processor and the ASUS ROG Zenith II Extreme motherboard in the screenshot below.
Availability & XMP 2.0 Support
These high-performance quad-channel memory specifications will support Intel XMP 2.0 for easy overclocking and will be available via G.SKILL worldwide distribution partners in late Q4 2019. Please see the specifications table below for a more complete list of the upcoming quad-channel memory kits.
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