My 4Gx2 set (F3-10666CL9D-8GBSQ) seems have some compatibility issues with Thinkpad W510.
Symptoms:
Random app crashes and BSoD.
System config:
Thinkpad W510 4389-CTO,
I7 720qm,
Motherboard Chipset: Intel QM57 (IbexPeak-M DO)
Quadro Fx880m,
The latest bios (1.34),
Windows 7 Pro with all the updates and the latest drivers,
4Gx2 installed in the first and third slot to form dual channel.
Mem info:
General information
Total Memory Size: 8 GBytes
Current Performance Settings
Maximum Supported Memory Clock: 666.7 MHz (5 : 1 ratio)
Current Memory Clock: 1818.2 MHz (5 : 1 ratio)
Current Timing (tCAS-tRCD-tRP-tRAS): 9.0-9-9-24
Memory Runs At: Dual-Channel
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different Rank: 6T
Read to Read Delay (tRD_RD) Different DIMM: 7T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different Rank: 7T
Write to Write Delay (tWR_WR) Different DIMM: 7T
Read to Write Delay (tRD_WR) Same Rank: 10T
Read to Write Delay (tRD_WR) Different Rank: 10T
Read to Write Delay (tRD_WR) Different DIMM: 10T
Write to Read Delay (tWR_RD) Same Rank (tWTR): 16T
Write to Read Delay (tWR_RD) Different Rank: 5T
Write to Read Delay (tWR_RD) Different DIMM: 5T
Read to Precharge Delay (tRTP): 5T
Write to Precharge Delay (tWTP/tWR): 21T
RAS# to RAS# Delay (tRRD): 4T
Refresh Cycle Time (tRFC): 107T
Four Activate Window (tFAW): 20T
Module 0 info
General Module Information
Module Number: 0
Module Size: 4096 MBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 666.7 MHz (PC3-10600)
Module Manufacturer: G Skill
Module Part Number: F3-10666CL9-4GBSQ
Module Revision: 0
Module Serial Number: 0
Module Manufacturing Date: Year: 2000, Week: 0
Module Manufacturing Location: 0
SDRAM Manufacturer: Unknown
Error Check/Correction: None
Module characteristics
Row Address Bits: 15
Column Address Bits: 10
Number Of Banks: 8
Module Density: 2048 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V
Module timing
Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
CAS# Latencies Supported: 6, 7, 8, 9
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 36.000 ns
Supported Module Timing at 666.7 MHz: 9-9-9-24
Supported Module Timing at 533.3 MHz: 7-7-7-20
Supported Module Timing at 400.0 MHz: 6-6-6-15
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 160.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
Features
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Module 1 info are largely the same.
Other info:
I ran 20 passes of extended Windows Memory diagnostic and found no problem. So it means the modules are not likely to be defective under normal operation conditions. Right?
Symptoms:
Random app crashes and BSoD.
System config:
Thinkpad W510 4389-CTO,
I7 720qm,
Motherboard Chipset: Intel QM57 (IbexPeak-M DO)
Quadro Fx880m,
The latest bios (1.34),
Windows 7 Pro with all the updates and the latest drivers,
4Gx2 installed in the first and third slot to form dual channel.
Mem info:
General information
Total Memory Size: 8 GBytes
Current Performance Settings
Maximum Supported Memory Clock: 666.7 MHz (5 : 1 ratio)
Current Memory Clock: 1818.2 MHz (5 : 1 ratio)
Current Timing (tCAS-tRCD-tRP-tRAS): 9.0-9-9-24
Memory Runs At: Dual-Channel
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different Rank: 6T
Read to Read Delay (tRD_RD) Different DIMM: 7T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different Rank: 7T
Write to Write Delay (tWR_WR) Different DIMM: 7T
Read to Write Delay (tRD_WR) Same Rank: 10T
Read to Write Delay (tRD_WR) Different Rank: 10T
Read to Write Delay (tRD_WR) Different DIMM: 10T
Write to Read Delay (tWR_RD) Same Rank (tWTR): 16T
Write to Read Delay (tWR_RD) Different Rank: 5T
Write to Read Delay (tWR_RD) Different DIMM: 5T
Read to Precharge Delay (tRTP): 5T
Write to Precharge Delay (tWTP/tWR): 21T
RAS# to RAS# Delay (tRRD): 4T
Refresh Cycle Time (tRFC): 107T
Four Activate Window (tFAW): 20T
Module 0 info
General Module Information
Module Number: 0
Module Size: 4096 MBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 666.7 MHz (PC3-10600)
Module Manufacturer: G Skill
Module Part Number: F3-10666CL9-4GBSQ
Module Revision: 0
Module Serial Number: 0
Module Manufacturing Date: Year: 2000, Week: 0
Module Manufacturing Location: 0
SDRAM Manufacturer: Unknown
Error Check/Correction: None
Module characteristics
Row Address Bits: 15
Column Address Bits: 10
Number Of Banks: 8
Module Density: 2048 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V
Module timing
Minimum SDRAM Cycle Time (tCKmin): 1.500 ns
CAS# Latencies Supported: 6, 7, 8, 9
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 36.000 ns
Supported Module Timing at 666.7 MHz: 9-9-9-24
Supported Module Timing at 533.3 MHz: 7-7-7-20
Supported Module Timing at 400.0 MHz: 6-6-6-15
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 6.000 ns
Minimum Active to Active/Refresh Time (tRCmin): 49.125 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 160.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 30.000 ns
Features
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Module 1 info are largely the same.
Other info:
I ran 20 passes of extended Windows Memory diagnostic and found no problem. So it means the modules are not likely to be defective under normal operation conditions. Right?
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