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There are some SKU where the IC type is known and limited due to specs, like any of the 2x16GB DDR4-3600 CL14-14-14 and CL14-15-15 models. They are a bit pricey, but have the upside of also being very decent overclockers
If a module is dual or single rank, basically comes down to IC density. Simplified you need 16 ICs of a lower density (8Gbit) or 8 ICs of a higher density (16Gbit) to achieve the same module capacity (16GB). In standard organization eight ICs will be 1Rx8 (single rank), while 16 ICs will be 2Rx8 (two ranks).
In general most specifications will be produced from what is available and can reasonably clear them. That allows a SKU like F4-3600C18D-32GTZN to be produced from a wide variety of IC types. So if a specific IC either is currently not available due to shortages or not available any longer because it was discontinued, then the IC type is going to be swapped. The number of ranks is probably not part of the specifications on the product pages, because the IC density can change with that.
I can tell that some 2x16GB SKU like the ones mentioned are exclusively using Samsung 8Gbit B-Die and therewith have to be dual rank, because there is no other (higher density) IC that could clear these specifications with a viable amount of binning. That has to do with the scaling properties of available IC types. That knowledge also allowed/helped me to compile and maintain the B-Die list at Hardwareluxx.
64GB & S8B would require 4x16GB, because of IC density. So those are not an option with a ITX motherboard. All current 2x32GB DDR4 kits are produced from 16Gbit ICs instead. The upside is, that those 32GB modules pretty have to be dual rank. Just don't expect the timings to match those of S8B based kits (esp. manually overclocked).
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