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Adding the same kit to F4-3200C16D-16GTZR

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  • Adding the same kit to F4-3200C16D-16GTZR

    Hello guys,

    I'm new to the forum and have been in contact with G.SKILL. But I would like to also ask for your real world advise regarding this dilemma I am having here.

    I recently bought an F4-3200C16D-16GTZR memory kit. SPD Binary extract details can be found after the jump.

    My dilemma is, I was supposed to buy 2 kits and run them together but at the time, the distributor had only 1 kit available and had to move the other kit over from another location. I was advised not to add another kit, as this could prove problematic, but I have already paid for that purchase.

    I have clarified with the supplier if the kit that I would be receiving would be the same exact one, and they said that it is of the same delivery batch from G.Skill.

    Could you provide me with feedback? I.e. why is this bad to do, or what may happen in case of the DIMMs being ïncompatible with each other.

    Looking forward to your help. Thank you so much.

    Manufacturing Description Module Manufacturer: G.Skill
    Module Part Number: F4-3200C16-8GTZR
    Module Series: Trident Z RGB
    DRAM Manufacturer: Hynix
    DRAM Components: H5AN8G8NAFR-TFC
    DRAM Die Revision / Lithography Resolution: A / 21 nm
    Module Manufacturing Date: Undefined
    Module Manufacturing Location: Taipei, Taiwan
    Module Serial Number: 00000000h
    Module PCB Revision: 00h
    Physical & Logical Attributes Fundamental Memory Class: DDR4 SDRAM
    Module Speed Grade: DDR4-2133
    Base Module Type: UDIMM (133.35 mm)
    Module Capacity: 8192 MB
    Reference Raw Card: A1 (8 layers)
    Initial Raw Card Designer: SK hynix
    Module Nominal Height: 31 < H <= 32 mm
    Module Thickness Maximum, Front: 1 < T <= 2 mm
    Module Thickness Maximum, Back: 1 < T <= 2 mm
    Number of DIMM Ranks: 1
    Address Mapping from Edge Connector to DRAM: Standard
    DRAM Device Package: Standard Monolithic
    DRAM Device Package Type: 78-ball FBGA
    DRAM Device Die Count: Single die
    Signal Loading: Not specified
    Number of Column Addresses: 10 bits
    Number of Row Addresses: 16 bits
    Number of Bank Addresses: 2 bits (4 banks)
    Bank Group Addressing: 2 bits (4 groups)
    DRAM Device Width: 8 bits
    Programmed DRAM Density: 8 Gb
    Calculated DRAM Density: 8 Gb
    Number of DRAM components: 8
    DRAM Page Size: 1 KB
    Primary Memory Bus Width: 64 bits
    Memory Bus Width Extension: 0 bits
    DRAM Post Package Repair: Supported
    Soft Post Package Repair: Supported
    DRAM Timing Parameters Fine Timebase: 0.001 ns
    Medium Timebase: 0.125 ns
    CAS Latencies Supported: 10T, 11T, 12T, 13T,
    14T, 15T, 16T
    DRAM Minimum Cycle Time: 0.938 ns
    DRAM Maximum Cycle Time: 1.600 ns
    Nominal DRAM Clock Frequency: 1066.10 MHz
    Minimum DRAM Clock Frequency: 625.00 MHz
    CAS# Latency Time (tAA min): 13.750 ns
    RAS# to CAS# Delay Time (tRCD min): 13.750 ns
    Row Precharge Delay Time (tRP min): 13.750 ns
    Active to Precharge Delay Time (tRAS min): 33.000 ns
    Act to Act/Refresh Delay Time (tRC min): 46.750 ns
    Normal Refresh Recovery Delay Time (tRFC1 min): 350.000 ns
    2x mode Refresh Recovery Delay Time (tRFC2 min): 260.000 ns
    4x mode Refresh Recovery Delay Time (tRFC4 min): 160.000 ns
    Short Row Active to Row Active Delay (tRRD_S min): 3.700 ns
    Long Row Active to Row Active Delay (tRRD_L min): 5.300 ns
    Write Recovery Time (tWR min): 15.000 ns
    Short Write to Read Command Delay (tWTR_S min): 2.500 ns
    Long Write to Read Command Delay (tWTR_L min): 7.500 ns
    Long CAS to CAS Delay Time (tCCD_L min): 5.625 ns
    Four Active Windows Delay (tFAW min): 21.000 ns
    Maximum Active Window (tMAW): 8192*tREFI
    Maximum Activate Count (MAC): Unlimited MAC
    DRAM VDD 1.20 V operable/endurant: Yes/Yes
    Thermal Parameters Module Thermal Sensor: Not Incorporated
    SPD Protocol SPD Revision: 1.1
    SPD Bytes Total: 512
    SPD Bytes Used: 384
    SPD Checksum (Bytes 00h-7Dh): 242Dh (OK)
    SPD Checksum (Bytes 80h-FDh): A01Ch (OK)
    Part number details JEDEC DIMM Label: 8GB 1Rx8 PC4-2133-UA1-11
    Frequency CAS RCD RP RAS RC RRDS RRDL WR WTRS WTRL FAW
    1067 MHz 16 15 15 36 50 4 6 16 3 8 23
    1067 MHz 15 15 15 36 50 4 6 16 3 8 23
    933 MHz 14 13 13 31 44 4 5 14 3 7 20
    933 MHz 13 13 13 31 44 4 5 14 3 7 20
    800 MHz 12 11 11 27 38 3 5 12 2 6 17
    800 MHz 11 11 11 27 38 3 5 12 2 6 17
    667 MHz 10 10 10 22 32 3 4 10 2 5 14
    Intel Extreme Memory Profiles Profiles Revision: 2.0
    Profile 1 (Certified) Enables: Yes
    Profile 2 (Extreme) Enables: No
    Profile 1 Channel Config: 2 DIMM/channel
    XMP Parameter Profile 1 Profile 2
    Speed Grade: DDR4-3200 N/A
    DRAM Clock Frequency: 1600 MHz N/A
    Module VDD Voltage Level: 1.35 V N/A
    Minimum DRAM Cycle Time (tCK): 0.625 ns N/A
    CAS Latencies Supported: 16T N/A
    CAS Latency Time (tAA): 16T N/A
    RAS# to CAS# Delay Time (tRCD): 18T N/A
    Row Precharge Delay Time (tRP): 18T N/A
    Active to Precharge Delay Time (tRAS): 38T N/A
    Active to Active/Refresh Delay Time (tRC): 56T N/A
    Four Activate Window Delay Time (tFAW): 39T N/A
    Short Activate to Activate Delay Time (tRRD_S): 6T N/A
    Long Activate to Activate Delay Time (tRRD_L): 8T N/A
    Normal Refresh Recovery Delay Time (tRFC1): 560T N/A
    2x mode Refresh Recovery Delay Time (tRFC2): 416T N/A
    4x mode Refresh Recovery Delay Time (tRFC4): 256T N/A

  • #2
    There are no guarantees with two separate kits since we did not test them together at factory. So in a sense it is up to the user to do that testing and see how well they can work together. In some cases they work great, in others a reduce frequency is necessary, and worst case scenario they don't boot up when installed together.

    When you pay for a complete kit, it is guaranteed to operate at the rated specs with that capacity. So with that 16GB kit, only those two modules to make up 16GB are guaranteed to run at 3200 C16. With RAM, same specs does not mean it will simply work with other modules of same spec.

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    • #3
      I appear to have won the silicon lottery with my new kit. Thanks GSKILL Tech for your help!

      https://valid.x86.fr/ldbc7n

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